High thermal conductivity, excellent electrical insulation, superior thermal stability, and reliable performance for semiconductor thermal management and high-power electronic applications.
Power electronics, semiconductor manufacturing, automotive electronics, aerospace, telecommunications, optical communication, and advanced thermal management applications.
Serving OEM customers in the USA, Germany, Japan, and Europe with customized ceramic substrates, thermal management solutions, and reliable supply support.
30–45 days, 50–65 days for complex structures and customized requirements.
High thermal conductivity ceramic substrates manufactured from Aluminum Nitride (AlN) and Silicon Carbide (SiC) are designed for power semiconductors, electronic power modules, and high thermal load systems. These ceramic substrates provide efficient heat dissipation, reliable electrical insulation, and excellent thermal stability to reduce operating temperatures and improve the long-term reliability of high-power electronic devices.
Aluminum Nitride ceramic provides excellent thermal conductivity and heat dissipation capability, making it suitable for high-power semiconductor devices and advanced thermal management applications.
Silicon Carbide ceramic offers excellent high-temperature performance, mechanical strength, and chemical stability, making it suitable for demanding power electronics and semiconductor applications.
High thermal conductivity enables rapid heat transfer and helps maintain stable operating temperatures in high-power electronic systems.
Maintains stable performance under high-temperature conditions and repeated thermal cycling environments.
Provides reliable electrical insulation while supporting efficient thermal dissipation.
Suitable thermal expansion characteristics help reduce thermal stress and improve device reliability.
| Parameter | AlN Ceramic Substrate | SiC Ceramic Substrate |
|---|---|---|
| Material | Aluminum Nitride (AlN) | Silicon Carbide (SiC) |
| Thermal Conductivity | 150–230 W/(m·K) | 120–200 W/(m·K) |
| Density | 3.20–3.30 g/cm³ | 3.05–3.20 g/cm³ |
| Flexural Strength | 300–350 MPa | 350–450 MPa |
| Thermal Expansion Coefficient | 4.5×10⁻⁶/K | 4.0–4.5×10⁻⁶/K |
| Surface Roughness | Ra ≤0.5 μm | Ra ≤0.5 μm |
| Material | Main Advantages | Typical Applications |
|---|---|---|
| Aluminum Nitride (AlN) | High thermal conductivity, electrical insulation, low thermal resistance | Power modules, semiconductor thermal management |
| Silicon Carbide (SiC) | High-temperature resistance, mechanical strength, chemical stability | High-power electronics, harsh environment applications |
| Alumina (Al₂O₃) | Good insulation performance and cost efficiency | General electronic insulation components |
CERAMPRO provides Aluminum Nitride (AlN) and Silicon Carbide (SiC) ceramic substrates for semiconductor thermal management and power electronic applications.
AlN ceramic substrates provide high thermal conductivity, low thermal resistance, and reliable electrical insulation for high-power electronic systems.
SiC ceramic substrates offer excellent high-temperature performance, mechanical strength, and chemical stability for demanding operating environments.
Yes. We provide customized ceramic substrates based on customer drawings, samples, and technical requirements.
Ceramic substrates help transfer heat efficiently while maintaining electrical insulation and structural reliability.
Yes. Prototype development, small batch production, and volume manufacturing are available.
Applications include semiconductor, power electronics, automotive electronics, aerospace, telecommunications, and advanced thermal management systems.
Yes. AlN and SiC ceramic substrates provide stable performance under high-temperature and thermal cycling conditions.
Yes. We provide customized ceramic substrate solutions for OEM customers in the USA, Germany, Japan, and Europe.
Yes. CERAMPRO is a China-based ceramic substrate manufacturer supplying customized AlN and SiC ceramic substrate solutions for global semiconductor and electronic OEM customers.
AlN Ceramic Substrate for Optical Module and Semiconductor Packaging
